The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Jun. 02, 2015

Filed:

Mar. 07, 2013
Applicant:

Brightek Optoelectronic Co., Ltd., Taoyuan County, TW;

Inventors:

Chien Chung Huang, Taoyuan County, TW;

Chih-Ming Wu, Taoyuan County, TW;

Yi Hsun Chen, Taipei, TW;

Chi Wei Liao, Taipei, TW;

Assignee:

BRIGHTEK OPTOELECTRONIC CO., LTD., Taoyuan County, TW;

Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H01L 33/00 (2010.01); H01L 21/00 (2006.01); H01L 33/08 (2010.01); H01L 27/15 (2006.01); H01L 27/146 (2006.01); H01L 25/16 (2006.01); H01L 25/075 (2006.01); H01L 33/38 (2010.01); H01L 33/54 (2010.01); H01L 33/48 (2010.01); H01L 33/50 (2010.01); H01L 33/62 (2010.01);
U.S. Cl.
CPC ...
H01L 33/08 (2013.01); H01L 27/156 (2013.01); H01L 33/38 (2013.01); H01L 27/14643 (2013.01); H01L 33/54 (2013.01); H01L 33/486 (2013.01); H01L 25/167 (2013.01); H01L 25/0753 (2013.01); H01L 33/50 (2013.01); H01L 33/62 (2013.01); H01L 2224/48091 (2013.01); H01L 2224/49113 (2013.01);
Abstract

A multichip package structure for generating a symmetrical and uniform light-blending source includes a substrate unit, a light-emitting unit and a package unit. The substrate unit includes a substrate body and at least one bridging conductive layer disposed on the top surface of the substrate body. The light-emitting unit includes at least two first light-emitting elements diagonally disposed on the substrate body and electrically connected to the substrate body and at least two second light-emitting elements diagonally disposed on the substrate body and electrically connected to the substrate body. The package unit includes at least two first light-transmitting package bodies respectively covering the at least two first light-emitting elements and at least two second light-transmitting package bodies respectively covering the at least two second light-emitting elements.


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