The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Jun. 02, 2015

Filed:

Mar. 05, 2013
Applicant:

Sony Corporation, Tokyo, JP;

Inventor:

Yukinobu Wataya, Kanagawa, JP;

Assignee:

Sony Corporation, Tokyo, JP;

Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H01L 31/02 (2006.01); H01L 27/146 (2006.01);
U.S. Cl.
CPC ...
H01L 31/02002 (2013.01); H01L 27/14618 (2013.01); H01L 27/14634 (2013.01); H01L 27/14636 (2013.01); H01L 27/1469 (2013.01);
Abstract

A solid image pick-up device has a plurality of light sensors arranged on its image pick-up area of a semiconductor substrate. A transparent plate having the same shape and size as the semiconductor substrate is bonded to the surface of the semiconductor substrate. A plurality of bonding pads are formed on the surface of the semiconductor substrate and arranged around the image pick-up area. Further, a plurality of through holes are formed through the semiconductor substrate, extending from the lower surfaces of the bonding pads to the back surface of the semiconductor substrate. An insulating film is attached to the inner surface of each of the through holes, while another insulating film is attached to the back surface of the semiconductor substrate.


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