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The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Patent No.:

US 9048240 B1

PDFFull Text
Date of Patent:
Jun. 02, 2015

Filed:

Dec. 27, 2012

Anisotropic conductive film and electronic device including the same

Applicants:

Young Woo Park, Uiwang-si, KR;

Nam Ju Kim, Uiwang-si, KR;

Kyoung Soo Park, Uiwang-si, KR;

Joon MO Seo, Uiwang-si, KR;

Kyung IL Sul, Uiwang-si, KR;

Dong Seon Uh, Uiwang-si, KR;

Arum Yu, Uiwang-si, KR;

Hyun Min Choi, Uiwang-si, KR;

Inventors:

Young Woo Park, Uiwang-si, KR;

Nam Ju Kim, Uiwang-si, KR;

Kyoung Soo Park, Uiwang-si, KR;

Joon Mo Seo, Uiwang-si, KR;

Kyung Il Sul, Uiwang-si, KR;

Dong Seon Uh, Uiwang-si, KR;

Arum Yu, Uiwang-si, KR;

Hyun Min Choi, Uiwang-si, KR;

Assignee:

CHEIL INDUSTRIES, INC., Gumi-si, Gyeongsangbuk-do, KR;

Attorney:

Lee & Morse, P.C.

Primary Examiner:

Colleen A Matthews

Assistant Examiner:

Junaiden Mirsalahuddin

Int. Cl.
CPC ...
H01B 1/00 (2006.01); H01L 23/48 (2006.01); H01L 23/538 (2006.01); C09J 9/02 (2006.01); C08G 59/22 (2006.01); C08G 59/24 (2006.01); H01L 23/00 (2006.01); C08L 63/00 (2006.01);
U.S. Cl.
CPC ...
H01L 23/538 (2013.01); H01L 2224/29371 (2013.01); H01L 2224/29366 (2013.01); H01L 2224/29324 (2013.01); H01L 2224/2939 (2013.01); H01L 2224/29455 (2013.01); H01L 2224/29439 (2013.01); H01L 2224/29447 (2013.01); H01L 24/16 (2013.01); H01L 24/29 (2013.01); H01L 24/32 (2013.01); H01L 24/73 (2013.01); H01L 2224/16225 (2013.01); H01L 2224/2929 (2013.01); H01L 2224/29339 (2013.01); H01L 2224/29344 (2013.01); H01L 2224/29347 (2013.01); H01L 2224/29355 (2013.01); H01L 2224/29364 (2013.01); H01L 2224/29386 (2013.01); H01L 2224/29393 (2013.01); H01L 2224/32225 (2013.01); H01L 2224/73204 (2013.01); H01L 2924/15788 (2013.01); H01L 2224/29444 (2013.01); C09J 9/02 (2013.01); C08G 59/226 (2013.01); C08G 59/245 (2013.01); C08L 63/00 (2013.01); H01L 2924/07811 (2013.01); C08K 2201/001 (2013.01); C08K 2201/011 (2013.01); H01L 2924/07802 (2013.01);
Abstract

An electronic device includes an anisotropic conductive film as a connection material, the anisotropic conductive film being formed from an anisotropic conductive film-forming composition. The anisotropic conductive film-forming composition includes a polycyclic aromatic ring-containing epoxy resin, a fluorene epoxy resin, nano silica and conductive particles.

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