The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Jun. 02, 2015

Filed:

Apr. 18, 2012
Applicants:

Kedar G. Shah, San Francisco, CA (US);

Satinderpall S. Pannu, Pleasanton, CA (US);

Terri L. Delima, Livermore, CA (US);

Inventors:

Kedar G. Shah, San Francisco, CA (US);

Satinderpall S. Pannu, Pleasanton, CA (US);

Terri L. Delima, Livermore, CA (US);

Assignee:
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H02G 3/04 (2006.01); H01B 13/06 (2006.01); A61N 1/375 (2006.01); H05K 3/44 (2006.01);
U.S. Cl.
CPC ...
H01B 13/06 (2013.01); A61N 1/3754 (2013.01); H05K 3/445 (2013.01); H02G 3/04 (2013.01);
Abstract

A method of fabricating electrical feedthroughs selectively removes substrate material from a first side of an electrically conductive substrate (e.g. a bio-compatible metal) to form an array of electrically conductive posts in a substrate cavity. An electrically insulating material (e.g. a bio-compatible sealing glass) is then flowed to fill the substrate cavity and surround each post, and solidified. The solidified insulating material is then exposed from an opposite second side of the substrate so that each post is electrically isolated from each other as well as the bulk substrate. In this manner a hermetic electrically conductive feedthrough construction is formed having an array of electrical feedthroughs extending between the first and second sides of the substrate from which it was formed.


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