The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Jun. 02, 2015

Filed:

Nov. 21, 2012
Applicants:

Wei Xu, Greenbelt, MD (US);

Jun Xu, Greenbelt, MD (US);

Zehra Serpil Gonen-williams, Lanham, MD (US);

Gregory D. Cooper, Arlington, VA (US);

Inventors:

Wei Xu, Greenbelt, MD (US);

Jun Xu, Greenbelt, MD (US);

Zehra Serpil Gonen-Williams, Lanham, MD (US);

Gregory D. Cooper, Arlington, VA (US);

Assignee:

PIXELLIGENT TECHNOLOGIES, LLC, Baltimore, MD (US);

Attorney:
Primary Examiner:
Int. Cl.
CPC ...
B32B 27/00 (2006.01); H01B 1/22 (2006.01); B01J 19/08 (2006.01); B05D 3/12 (2006.01); B05D 5/00 (2006.01); B05D 3/02 (2006.01); B29C 47/00 (2006.01); B29C 43/00 (2006.01); B29C 45/00 (2006.01); C09K 5/00 (2006.01); H01B 1/12 (2006.01); H05K 3/22 (2006.01); H01B 1/24 (2006.01);
U.S. Cl.
CPC ...
H01B 1/22 (2013.01); Y10T 29/49117 (2015.01); B01J 19/08 (2013.01); B05D 3/12 (2013.01); B05D 5/00 (2013.01); B05D 3/02 (2013.01); B29C 47/00 (2013.01); B29C 43/00 (2013.01); B29C 45/00 (2013.01); C09K 5/00 (2013.01); H01B 1/12 (2013.01); H05K 3/22 (2013.01); B29C 47/0014 (2013.01); B29C 47/0016 (2013.01); H01B 1/24 (2013.01);
Abstract

Domain segregation of polymer blends or block copolymers in the presence of thermal conducting high aspect ratio nanocrystals leads to preferential placement of conductive filler either inside one domain, which promote the self-assembly of a thermal and/or electrical conducting pathway composed of high aspect ratio filler. The self-assembly of such thermal and/or electrical conducting pathway effectively enhances the thermal and/or electrical conductivity of the composite with significantly less amount of filler.


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