The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Jun. 02, 2015
Filed:
Jun. 06, 2011
Nobuhito Suehira, Kawasaki, JP;
Junichi Seki, Yokohama, JP;
Masao Majima, Isehara, JP;
Atsunori Terasaki, Kawasaki, JP;
Hideki Ina, Utsunomiya, JP;
Nobuhito Suehira, Kawasaki, JP;
Junichi Seki, Yokohama, JP;
Masao Majima, Isehara, JP;
Atsunori Terasaki, Kawasaki, JP;
Hideki Ina, Utsunomiya, JP;
CANON KABUSHIKI KAISHA, Tokyo, JP;
Abstract
A light transmissive mold used for imprinting a pattern onto a material applied on a semiconductor workpiece. The mold includes a first surface having an area of a pattern to be imprinted onto the material, a second surface located opposite from the first surface, and a third surface disposed between the first surface and the second surface, at a position inwardly away from the first surface. The third surface is arranged opposite to an area of the workpiece subjected to dicing. An alignment structure, provided for alignment between the mold and the workpiece, is formed in the third surface.