The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Jun. 02, 2015

Filed:

Jan. 31, 2013
Applicant:

Israel Military Industries Ltd., Ramat Hasharon, IL;

Inventors:

Ron Bergman, Kiryat-Ono, IL;

Benjamin Yavin, Rishon Lezion, IL;

Assignee:

ISRAEL MILITARY INDUSTRIES LTD., Ramat Hasharon, IL;

Attorney:
Primary Examiner:
Int. Cl.
CPC ...
F41H 5/02 (2006.01); F41H 5/04 (2006.01); B63B 3/10 (2006.01); B64D 7/00 (2006.01); F41H 1/02 (2006.01); F41H 1/04 (2006.01); F41H 7/02 (2006.01);
U.S. Cl.
CPC ...
F41H 5/0421 (2013.01); Y10T 156/10 (2015.01); F41H 5/0428 (2013.01); B63B 3/10 (2013.01); B64D 7/00 (2013.01); F41H 1/02 (2013.01); F41H 1/04 (2013.01); F41H 5/0414 (2013.01); F41H 7/02 (2013.01);
Abstract

A light weight pre-stressed antiballistic article including a monolith ceramic plate/tile bonded to a thin lightweight thermal expansion material with an adhesive, characterized, in that the thermal expansion material has a thermal expansion coefficient at least 50% higher than the ceramic plate/tile, and the thermal expansion material is bonded to either the front face, back face or both faces of the ceramic plate/tile at a bonding temperature of between 50° C. and 250° C. with adhesive and subsequently cooled, whereby upon cooling, the bonded thermal expansion material contracts to a greater extent than the ceramic plate/tile, exerting compression stress on the ceramic plate/tile.


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