The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Jun. 02, 2015

Filed:

Jan. 10, 2007
Applicants:

Jae Ho Cho, Seoul, KR;

Jung Yun Kim, Seoul, KR;

Kang Hyun Cho, Seoul, KR;

Inventors:

Jae Ho Cho, Seoul, KR;

Jung Yun Kim, Seoul, KR;

Kang Hyun Cho, Seoul, KR;

Assignee:
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H01L 27/14 (2006.01); F21V 29/00 (2006.01); H05K 3/32 (2006.01); F21S 8/10 (2006.01); F21V 19/04 (2006.01); F21Y 101/02 (2006.01);
U.S. Cl.
CPC ...
F21V 29/004 (2013.01); F21S 48/1104 (2013.01); F21S 48/328 (2013.01); F21V 19/04 (2013.01); F21V 29/2212 (2013.01); F21Y 2101/02 (2013.01); H05K 3/325 (2013.01); H05K 2201/09063 (2013.01); H05K 2201/10106 (2013.01); H05K 2201/10651 (2013.01); H05K 2203/167 (2013.01);
Abstract

The present invention relates to a light emitting diode (LED) lamp, and an object of the present invention is to provide an LED lamp in which an LED can be easily exchanged and external vibration can be absorbed to prevent the play thereof. To this end, an LED lamp according to the present invention comprises an LED package having a lead frame; a printed circuit board separated from the LED package and having a conductive pattern formed on a surface thereof facing the lead frame; and a pressing means for pressing the LED package toward the PCB so that the lead frame is in contact with the conductive pattern.


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