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The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Patent No.:

US 9045632 B1

PDFFull Text
Date of Patent:
Jun. 02, 2015

Filed:

Nov. 28, 2012

Method for producing composition for injection molding comprising cryogenic grinding of resin components, and composition for injection molding

Applicant:

Seiko Epson Corporation, Tokyo, JP;

Inventors:

Hidefumi Nakamura, Hachinohe, JP;

Nobuyuki Hamakura, Yuzawa, JP;

Assignee:

Seiko Epson Corporation, , JP;

Attorney:

Harness, Dickey & Pierce, P.L.C.

Primary Examiner:

Holly Le

Int. Cl.
CPC ...
B32B 5/16 (2006.01); B22C 25/00 (2006.01); C08L 63/00 (2006.01); C08L 59/00 (2006.01); B22F 1/00 (2006.01); B22F 3/22 (2006.01); C04B 35/626 (2006.01); C04B 35/634 (2006.01); B28B 1/24 (2006.01); B28B 11/24 (2006.01); B29C 45/78 (2006.01); C08K 3/00 (2006.01);
U.S. Cl.
CPC ...
C08L 63/00 (2013.01); Y10T 428/2993 (2015.01); C08L 59/00 (2013.01); C08K 3/0033 (2013.01); B22F 1/0059 (2013.01); B22F 3/225 (2013.01); B22F 2001/0066 (2013.01); C04B 35/6263 (2013.01); C04B 35/62675 (2013.01); C04B 35/634 (2013.01); C04B 35/6342 (2013.01); C04B 35/63424 (2013.01); C04B 35/63452 (2013.01); C04B 2235/5436 (2013.01); C04B 2235/6022 (2013.01); B28B 1/24 (2013.01); B28B 11/243 (2013.01);
Abstract

A method for producing a composition for injection molding which contains an inorganic powder composed of at least one of a metal material and a ceramic material and a binder containing a polyacetal-based resin and a glycidyl group-containing polymer. The method includes: cryogenically grinding a first resin containing the polyacetal-based resin as a main component; cryogenically grinding a second resin containing the glycidyl group-containing polymer as a main component; mixing a powder obtained by grinding the first resin, a powder obtained by grinding the second resin, and the inorganic powder, thereby obtaining a mixed powder; and kneading the mixed powder.

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