The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Jun. 02, 2015

Filed:

Apr. 03, 2012
Applicant:

Cesar Lozano Villarreal, Sunnyvale, CA (US);

Inventor:

Cesar Lozano Villarreal, Sunnyvale, CA (US);

Assignee:

Apple Inc., Cupertino, CA (US);

Attorneys:
Primary Examiner:
Int. Cl.
CPC ...
B29C 65/18 (2006.01); H05K 13/08 (2006.01); B29C 65/20 (2006.01); B29C 65/34 (2006.01); B29C 65/48 (2006.01); B29C 65/50 (2006.01); B29C 65/00 (2006.01); H05K 5/00 (2006.01); B29L 31/34 (2006.01); B29C 65/16 (2006.01); B29C 65/02 (2006.01);
U.S. Cl.
CPC ...
B29C 65/20 (2013.01); Y10T 156/1052 (2015.01); B29C 66/11 (2013.01); B29C 65/18 (2013.01); H05K 5/0004 (2013.01); H05K 13/08 (2013.01); B29L 2031/3481 (2013.01); B29C 65/16 (2013.01); B29C 65/3444 (2013.01); B29C 65/3468 (2013.01); B29C 65/348 (2013.01); B29C 65/4835 (2013.01); B29C 65/5057 (2013.01); B29C 66/1142 (2013.01); B29C 66/1226 (2013.01); B29C 66/12443 (2013.01); B29C 66/12463 (2013.01); B29C 66/54 (2013.01); B29C 65/02 (2013.01); B29C 66/1224 (2013.01); B29C 66/91411 (2013.01); B29C 65/3476 (2013.01); B29C 66/91945 (2013.01); B29C 66/91431 (2013.01); B29C 66/91655 (2013.01); B29C 66/919 (2013.01); B29C 66/83221 (2013.01);
Abstract

An electronic device may have electronic components enclosed within a plastic housing. The plastic housing may include housing members that are joined using heat activated thermoset polymer film. The heat activated thermoset polymer film may be heated using a metal structure such as a strip of metal that is placed along a joint between the housing members. The temperature of the metal strip and associated layers of the thermoset polymer film may be raised by applying current to the metal strip using an external tool or the electronic components within the housing. Heat activated thermoset polymer film may be heated using a reactive multilayer metal foil. Heat sink layers of metal may be interposed between the reactive multilayer metal foil and the thermoset polymer film. A heated metal ring or a heated edge portion of a plastic housing member may also be used to heat the thermoset polymer film.


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