Production method of wafer lens

Abstract

The aim is to regulate thickness on the optical axis in the production of wafer lenses. Disclosed is a wafer lens production method that is equipped with a dispensing process for dropping resin onto a molding die (), an imprinting process for pressing either the molding die () or a glass substrate () toward the other, and a releasing process for releasing the glass substrate () from the molding die (), and that repeats the processing from the dispensing process to the releasing process as a single cycle and successively forms resin lenses () on the glass substrate); wherein the height (A) of the non-lens area () surrounding the lenses () and the heights (B and C) of the glass substrate () are measured between the releasing process of a first cycle and the dispensing process of a second cycle, and the position of the molding die () is corrected for imprinting processes of the second cycle, on the basis of the heights (A-C).