The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Jun. 02, 2015

Filed:

Oct. 13, 2008
Applicants:

Kishore Krishna Kumar, Bangalore, IN;

Raviprakash Jayaraman, Bangalore, IN;

Sankaranand Kaipa Narasimha, Bangalore, IN;

Renjith Mahiladevi Radhakrishnan, Bangalore, IN;

Sathyadeep Viswanathan, Bangalore, IN;

Chandrasekhar Bhaskaran Nair, Bangalore, IN;

Pillarisetti Venkata Subbarao, Bangalore, IN;

Manjula Jagannath, Bangalore, IN;

Shilpa Chennakrishnaiah, Bangalore, IN;

Inventors:

Kishore Krishna Kumar, Bangalore, IN;

Raviprakash Jayaraman, Bangalore, IN;

Sankaranand Kaipa Narasimha, Bangalore, IN;

Renjith Mahiladevi Radhakrishnan, Bangalore, IN;

Sathyadeep Viswanathan, Bangalore, IN;

Chandrasekhar Bhaskaran Nair, Bangalore, IN;

Pillarisetti Venkata Subbarao, Bangalore, IN;

Manjula Jagannath, Bangalore, IN;

Shilpa Chennakrishnaiah, Bangalore, IN;

Assignee:

Bigtec Private Limited, Bangalore, Karnataka, IN;

Attorney:
Primary Examiner:
Int. Cl.
CPC ...
C12Q 1/68 (2006.01); B01L 7/00 (2006.01); C04B 35/00 (2006.01); B01L 3/00 (2006.01);
U.S. Cl.
CPC ...
B01L 7/52 (2013.01); B01L 3/5027 (2013.01); B01L 2300/0627 (2013.01); B01L 2300/0851 (2013.01); B01L 2300/0887 (2013.01); B01L 2300/16 (2013.01); B01L 2300/1805 (2013.01);
Abstract

Instant invention is about a micro chip comprising plurality of layers of LTCC wherein a reaction chamber is formed in plurality of top layers to load samples. A heater embedded in at least one of the layers below the reaction chamber and a temperature sensor is embedded in at least one of the layers between the heater and the reaction chamber for analyzing the sample. The temperature sensor can be placed outside the chip to measure the chip temperature.


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