The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Jun. 02, 2015

Filed:

Mar. 01, 2013
Applicants:

Kenneth Wu, Sunnyvale, CA (US);

Dean HU, Sunnyvale, CA (US);

Sumona Nag, Sunnyvale, CA (US);

Inventors:

Kenneth Wu, Sunnyvale, CA (US);

Dean Hu, Sunnyvale, CA (US);

Sumona Nag, Sunnyvale, CA (US);

Assignee:

Spiracur Inc., Sunnyvale, CA (US);

Attorneys:
Primary Examiner:
Assistant Examiner:
Int. Cl.
CPC ...
A61F 5/44 (2006.01); A61B 17/08 (2006.01); A61M 27/00 (2006.01); A61M 35/00 (2006.01); A61F 7/00 (2006.01); A61F 13/00 (2006.01); A61M 1/00 (2006.01); A61M 5/178 (2006.01); A61M 5/24 (2006.01); A61M 25/00 (2006.01);
U.S. Cl.
CPC ...
A61B 17/085 (2013.01); A61F 2013/00536 (2013.01); A61M 1/0088 (2013.01); A61M 27/00 (2013.01); A61M 1/0076 (2013.01); A61M 1/009 (2014.02); A61M 1/0096 (2014.02);
Abstract

Disclosed herein are devices, systems and methods for using such devices and systems for treating incisions and wounds. In an aspect, disclosed is a device having a generally planar tension relief module and a flexible sealant structure sized to cover the tension relief module, the flexible sealant structure comprising a lower adhesive surface. The tension relief module includes a conduit structure having a plurality of support structures on an upper surface of the conduit structure and at least one opening extending through the conduit structure from a lower surface to the upper surface. At least a portion of the conduit structure is adapted to be aligned with a longitudinal axis of the incision. The tension relief module also includes opposing adhesive structures coupled to the conduit structure. The lower adhesive surface of the flexible sealant structure and the upper surface of the conduit structure form a flow pathway.


Find Patent Forward Citations

Loading…