The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Jun. 02, 2015

Filed:

Apr. 26, 2012
Applicants:

Norihiro Ishii, Akishima, JP;

Takahiro Sugai, Kokubunji, JP;

Inventors:

Norihiro Ishii, Akishima, JP;

Takahiro Sugai, Kokubunji, JP;

Assignee:
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
A61B 1/00 (2006.01); H01L 23/053 (2006.01); A61B 1/12 (2006.01); H05K 1/11 (2006.01); H05K 3/34 (2006.01); H01L 23/498 (2006.01);
U.S. Cl.
CPC ...
A61B 1/00004 (2013.01); A61B 1/0011 (2013.01); A61B 1/121 (2013.01); H05K 1/111 (2013.01); H05K 3/3436 (2013.01); H05K 2201/094 (2013.01); H05K 2201/10719 (2013.01); H05K 2201/10977 (2013.01); H01L 23/49805 (2013.01); H01L 2924/15153 (2013.01); H01L 2924/15313 (2013.01); H01L 2924/16195 (2013.01); H01L 23/053 (2013.01); H01L 2924/0002 (2013.01);
Abstract

According to one exemplary embodiment, an endoscope apparatus includes: an insertion unit that is an object to be disinfected by boiling; an operation unit connected to the insertion part; a main unit connected to the operation unit; a first circuit board embedded in the main unit; a first electronic component electrically connected to the first circuit board via a first solder; a second circuit board embedded in at least any one of the insertion unit and the operation unit; a second electronic component electrically connected to the second circuit board via a second solder having higher stress resistance than that of the first solder; and a bonding member bonded to the second electronic component and the second circuit board, the bonding member having a glass transition point higher than that of the second circuit board.


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