The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
May. 26, 2015

Filed:

Mar. 23, 2012
Applicants:

Jikai Zhang, Beijing, CN;

Jiyu Wan, Beijing, CN;

Hongjiang Wu, Beijing, CN;

Seungmoo Rim, Beijing, CN;

Inventors:

Jikai Zhang, Beijing, CN;

Jiyu Wan, Beijing, CN;

Hongjiang Wu, Beijing, CN;

Seungmoo Rim, Beijing, CN;

Attorney:
Primary Examiner:
Int. Cl.
CPC ...
G01B 21/18 (2006.01); C23C 14/34 (2006.01); H01J 37/34 (2006.01);
U.S. Cl.
CPC ...
G01B 21/18 (2013.01); G01B 2210/56 (2013.01); C23C 14/3414 (2013.01); H01J 37/3414 (2013.01); H01J 37/3491 (2013.01);
Abstract

The disclosed technology provides a manufacturing method of a target comprising obtaining an initial mass and a residual mass of the target sample, and calculating an etching mass; determining a relative etching depth of the target sample; calculating a relative etching mass based on the etching mass and the relative etching depth; determining a utilization parameter of the target sample based on the relative etching mass and the initial mass of the target sample before being used; and performing a simulation and optimization process on the utilization parameter of the target sample, obtaining target parameters corresponding to a preset value of the utilization parameter, and outputting the target parameters to a manufacturing control center for manufacturing a target. The disclosed technology also provides a manufacturing system of a target.


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