The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
May. 26, 2015

Filed:

Oct. 01, 2013
Applicant:

International Business Machines Corporation, Armonk, NY (US);

Inventors:

Martin Beaumier, Quebec, CA;

Alexandre Blander, Quebec, CA;

Pascale Gagnon, Quebec, CA;

Michael A. Gaynes, Vestal, NY (US);

Eric Giguere, Quebec, CA;

Eric Salvas, Quebec, CA;

Luc Tousignant, Quebec, CA;

Attorneys:
Primary Examiner:
Assistant Examiner:
Int. Cl.
CPC ...
H05K 9/00 (2006.01); H05K 1/00 (2006.01); H05K 1/18 (2006.01); H05K 7/00 (2006.01); H01L 23/055 (2006.01); H01L 23/10 (2006.01); H01L 23/552 (2006.01);
U.S. Cl.
CPC ...
H05K 9/0009 (2013.01); H01L 23/055 (2013.01); H01L 23/10 (2013.01); H01L 23/552 (2013.01); H01L 2224/16225 (2013.01); H01L 2224/73204 (2013.01); H01L 2224/73253 (2013.01); H01L 2924/15311 (2013.01); H01L 2224/32225 (2013.01); H01L 2924/16251 (2013.01); H01L 2924/10253 (2013.01);
Abstract

An apparatus for reducing EMI at the micro-electronic-component level includes a substrate having a ground conductor integrated therein. A micro-electronic component such as an integrated circuit is mounted to the substrate. An electrically conductive lid is mounted to the substrate, thereby forming a physical interface with the substrate. The electrically conductive lid substantially covers the micro-electronic component. A conductive link is provided to create an electrical connection between the electrically conductive lid and the ground conductor at the physical interface.


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