The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
May. 26, 2015
Filed:
Nov. 20, 2012
Applicant:
Samsung Electro-mechanics Co., Ltd., Gyunggi-do, KR;
Inventor:
Joon Sung Kim, Gyunggi-do, KR;
Assignee:
Samsung Electro-Mechanics Co., Ltd., Gyunggi-Do, KR;
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H05K 7/00 (2006.01); H05K 1/11 (2006.01); H05K 3/06 (2006.01); H05K 3/40 (2006.01); H05K 3/34 (2006.01); H05K 3/46 (2006.01);
U.S. Cl.
CPC ...
H05K 1/11 (2013.01); H05K 3/06 (2013.01); H05K 3/4038 (2013.01); H05K 3/3452 (2013.01); H05K 3/4007 (2013.01); H05K 3/4661 (2013.01); H05K 2201/0376 (2013.01); H05K 2203/1476 (2013.01);
Abstract
Disclosed herein are a printed circuit board and a method of manufacturing the same. The printed circuit board includes: a base substrate; an outer circuit layer formed on an upper portion of the base substrate and including a connection pad; a first solder resist formed on the upper portion of the base substrate so that the connection pad of the outer circuit layer is exposed; and a second solder resist formed on an upper portion of an outer circuit layer and formed so that the connection pad is exposed.