The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
May. 26, 2015

Filed:

Nov. 18, 2011
Applicants:

Douglas M. Reber, Austin, TX (US);

Lawrence N. Herr, Coupland, TX (US);

Inventors:

Douglas M. Reber, Austin, TX (US);

Lawrence N. Herr, Coupland, TX (US);

Assignee:
Attorney:
Primary Examiner:
Assistant Examiner:
Int. Cl.
CPC ...
H01L 23/498 (2006.01); G06F 17/50 (2006.01); H01L 21/768 (2006.01);
U.S. Cl.
CPC ...
G06F 17/5068 (2013.01); H01L 21/76814 (2013.01); H01L 21/76828 (2013.01);
Abstract

In a disclosed embodiment, a method for tiling selected vias in a semiconductor device having a plurality of vias comprises generating a layout database for the semiconductor device; creating zones around the plurality of vias; measuring density of covering metal in each zone; selecting a low density zone as being a zone that has a metal density less than a threshold metal density; and adding at least one tiling feature on a metal layer above the plurality of vias in the low density zone so that metal density of the low density zone increases to at least the same as the threshold metal density.


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