The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
May. 26, 2015
Filed:
Dec. 31, 2009
Applicants:
Makoto Murai, Oita, JP;
Yoshimichi Harada, Kanagawa, JP;
Inventors:
Makoto Murai, Oita, JP;
Yoshimichi Harada, Kanagawa, JP;
Assignee:
Sony Corporation, Tokyo, JP;
Primary Examiner:
Int. Cl.
CPC ...
H01L 23/48 (2006.01); H01L 23/00 (2006.01); H01L 21/56 (2006.01); H01L 23/498 (2006.01); H01L 25/065 (2006.01); H01L 23/31 (2006.01); H01L 25/03 (2006.01);
U.S. Cl.
CPC ...
H01L 24/12 (2013.01); H01L 21/563 (2013.01); H01L 21/565 (2013.01); H01L 23/3128 (2013.01); H01L 23/49811 (2013.01); H01L 23/49838 (2013.01); H01L 24/16 (2013.01); H01L 24/17 (2013.01); H01L 24/28 (2013.01); H01L 24/32 (2013.01); H01L 24/81 (2013.01); H01L 24/83 (2013.01); H01L 25/03 (2013.01); H01L 25/0657 (2013.01); H01L 2224/1132 (2013.01); H01L 2224/1134 (2013.01); H01L 2224/1308 (2013.01); H01L 2224/13082 (2013.01); H01L 2224/13083 (2013.01); H01L 2224/13111 (2013.01); H01L 2224/13144 (2013.01); H01L 2224/13147 (2013.01); H01L 2224/13155 (2013.01); H01L 2224/13166 (2013.01); H01L 2224/16145 (2013.01); H01L 2224/16225 (2013.01); H01L 2224/27013 (2013.01); H01L 2224/48091 (2013.01); H01L 2224/48227 (2013.01); H01L 2224/73203 (2013.01); H01L 2224/81121 (2013.01); H01L 2224/81193 (2013.01); H01L 2224/81801 (2013.01); H01L 2224/83051 (2013.01); H01L 2224/83101 (2013.01); H01L 2224/838 (2013.01); H01L 2225/0651 (2013.01); H01L 2225/06513 (2013.01); H01L 2225/06582 (2013.01); H01L 2924/01005 (2013.01); H01L 2924/01013 (2013.01); H01L 2924/01022 (2013.01); H01L 2924/01029 (2013.01); H01L 2924/01033 (2013.01); H01L 2924/01047 (2013.01); H01L 2924/0105 (2013.01); H01L 2924/01078 (2013.01); H01L 2924/01079 (2013.01); H01L 2924/01082 (2013.01); H01L 2924/0781 (2013.01); H01L 2924/15311 (2013.01); H01L 2924/19107 (2013.01); H01L 2924/30105 (2013.01); H01L 2224/0558 (2013.01); H01L 24/48 (2013.01); H01L 2224/05624 (2013.01); H01L 2224/2919 (2013.01); H01L 2924/00013 (2013.01); H01L 2924/01006 (2013.01); H01L 2924/01019 (2013.01); H01L 2924/014 (2013.01); H01L 2924/0665 (2013.01); H01L 24/29 (2013.01); H01L 2224/32225 (2013.01); H01L 2224/73204 (2013.01); H01L 2224/73265 (2013.01); H01L 2924/0132 (2013.01); H01L 2224/29111 (2013.01); H01L 2224/83192 (2013.01); H01L 2224/32145 (2013.01); H01L 2224/92125 (2013.01); H01L 2924/1579 (2013.01); H01L 2224/26145 (2013.01); H01L 2224/26175 (2013.01); H01L 2224/73215 (2013.01); H01L 2224/73253 (2013.01);
Abstract
A semiconductor device includes: a mount body; a semiconductor chip mounted on the mount body via projecting connecting terminals; and a filling resin filled between the mount body and the semiconductor chip to seal the connecting terminals, the filling resin being retained inside the semiconductor chip in such a way as not to run out of at least one side portion in four side portions defining an outer peripheral portion of the semiconductor chip.