The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
May. 26, 2015

Filed:

Mar. 15, 2012
Applicants:

Noritoshi Takamura, Kanagawa, JP;

Michiya Masuda, Kanagawa, JP;

Ichiro Sasuga, Kanagawa, JP;

Nobuharu Kato, Nagano, JP;

Kengo Tsurugai, Nagano, JP;

Inventors:

Noritoshi Takamura, Kanagawa, JP;

Michiya Masuda, Kanagawa, JP;

Ichiro Sasuga, Kanagawa, JP;

Nobuharu Kato, Nagano, JP;

Kengo Tsurugai, Nagano, JP;

Assignee:

NHK Spring Co., Ltd., Yokohama-shi, JP;

Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H01L 23/34 (2006.01); H01L 23/40 (2006.01); H01L 23/433 (2006.01); H01L 23/473 (2006.01); H01L 25/11 (2006.01); H02M 7/00 (2006.01); H02M 1/32 (2007.01);
U.S. Cl.
CPC ...
H01L 23/40 (2013.01); H01L 23/4012 (2013.01); H01L 23/433 (2013.01); H01L 23/473 (2013.01); H01L 25/112 (2013.01); H02M 7/003 (2013.01); H01L 2924/0002 (2013.01); H02M 2001/327 (2013.01);
Abstract

The pressure unit includes a spring member that is formed into a coil form obtained by winding a wire rod and that has a periodically changing pitch angle and a housing member to which end portions of the spring member are attached, and the pressure unit pressurizes a semiconductor stacked unit obtained by alternately stacking a semiconductor element module and a cooling tube that makes contact with the semiconductor element module and cools the semiconductor element module.


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