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The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Patent No.:

US 9041182 B1

PDFFull Text
Date of Patent:
May. 26, 2015

Filed:

Nov. 29, 2012

Semiconductor package and method of manufacturing the same

Applicants:

Toshihiko Nagano, Kanagawa, JP;

Kazuhide Abe, Kanagawa, JP;

Hiroshi Yamada, Kanagawa, JP;

Kazuhiko Itaya, Kanagawa, JP;

Taihei Nakada, Kanagawa, JP;

Inventors:

Toshihiko Nagano, Kanagawa, JP;

Kazuhide Abe, Kanagawa, JP;

Hiroshi Yamada, Kanagawa, JP;

Kazuhiko Itaya, Kanagawa, JP;

Taihei Nakada, Kanagawa, JP;

Assignee:

Kabushiki Kaisha Toshiba, Tokyo, JP;

Attorney:

Oblon, McClelland, Maier & Neustadt, L.L.P.

Primary Examiner:

Timor Karimy

Int. Cl.
CPC ...
H01L 23/48 (2006.01); H01L 21/78 (2006.01); H01L 23/055 (2006.01); H01L 23/10 (2006.01); H01L 23/00 (2006.01); H01L 23/66 (2006.01);
U.S. Cl.
CPC ...
H01L 23/48 (2013.01); H01L 21/78 (2013.01); H01L 23/055 (2013.01); H01L 23/10 (2013.01); H01L 23/66 (2013.01); H01L 2224/73253 (2013.01); H01L 2224/81895 (2013.01); H01L 24/13 (2013.01); H01L 24/16 (2013.01); H01L 24/17 (2013.01); H01L 24/81 (2013.01); H01L 24/97 (2013.01); H01L 2224/05644 (2013.01); H01L 2224/0603 (2013.01); H01L 2224/06181 (2013.01); H01L 2224/12105 (2013.01); H01L 2224/13007 (2013.01); H01L 2224/13111 (2013.01); H01L 2224/133 (2013.01); H01L 2224/14181 (2013.01); H01L 2224/16235 (2013.01); H01L 2224/81191 (2013.01); H01L 2224/81192 (2013.01); H01L 2224/81205 (2013.01); H01L 2224/814 (2013.01); H01L 2224/81411 (2013.01); H01L 2224/81444 (2013.01); H01L 2224/81447 (2013.01); H01L 2224/81805 (2013.01); H01L 2224/81815 (2013.01); H01L 2224/81986 (2013.01); H01L 2224/97 (2013.01); H01L 2924/1515 (2013.01); H01L 2924/16153 (2013.01); H01L 2224/05568 (2013.01); H01L 2224/1329 (2013.01); H01L 2924/1461 (2013.01);
Abstract

A semiconductor package according to embodiments includes: a semiconductor chip including a front electrode on a front surface thereof and a back electrode on a back surface thereof; a front-side cap portion including an air gap in a portion between the semiconductor chip and the front-side cap portion and a front-side penetrating electrode, and is positioned to face the front surface of the semiconductor chip; a back-side cap portion bonded with a first cap portion to hermetically seal the semiconductor chip, includes an air gap at least in a portion between the semiconductor chip and the back-side cap portion and a back-side penetrating electrode, and is positioned to face the back surface of the semiconductor chip; a front-side connecting portion which electrically connects the front electrode and the front-side penetrating electrode; and a back-side connecting portion which electrically connects the back electrode and the back-side penetrating electrode.

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