The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
May. 26, 2015

Filed:

Oct. 19, 2012
Applicant:

International Rectifier Corporation, El Segundo, CA (US);

Inventors:

Eung San Cho, Torrance, CA (US);

Dean Fernando, Torrance, CA (US);

Tim Philips, Hope, RI (US);

Dan Clavette, Greene, RI (US);

Assignee:
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H01L 23/06 (2006.01); H01L 23/48 (2006.01); H01L 23/00 (2006.01);
U.S. Cl.
CPC ...
H01L 24/37 (2013.01); H01L 24/41 (2013.01); H01L 24/92 (2013.01); H01L 2224/37032 (2013.01); H01L 2224/37124 (2013.01); H01L 2224/37147 (2013.01); H01L 2224/38 (2013.01); H01L 2224/40227 (2013.01); H01L 2224/45099 (2013.01); H01L 2224/48091 (2013.01); H01L 2224/48227 (2013.01); H01L 2224/49171 (2013.01); H01L 2224/73221 (2013.01); H01L 2224/84205 (2013.01); H01L 2224/84801 (2013.01); H01L 2224/92246 (2013.01); H01L 2924/00 (2013.01); H01L 2924/00014 (2013.01); H01L 2924/1305 (2013.01); H01L 2924/13055 (2013.01); H01L 2924/1306 (2013.01); H01L 2924/13064 (2013.01); H01L 2924/13091 (2013.01); H01L 2924/30107 (2013.01);
Abstract

According to an exemplary embodiment, a monolithic power converter package includes a monolithic die over a substrate, the monolithic die integrating a driver integrated circuit (IC) with a control power transistor and a sync power transistor connected in a half-bridge. A high side power input, a low side power input, and a power output of the half-bridge are each disposed on a top surface of the monolithic die. The high side power input is electrically and mechanically coupled to the substrate by a high side power strip. Also, the low side power input is electrically and mechanically coupled to the substrate by a low side power strip. Furthermore, the power output is electrically and mechanically coupled to the substrate by a power output strip.


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