The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
May. 26, 2015

Filed:

May. 12, 2011
Applicants:

Haekyung Lee, Seoul, KR;

Choongyoul Kim, Seoul, KR;

Hyungoo Kang, Seoul, KR;

Kiho Hong, Seoul, KR;

Inventors:

HaeKyung Lee, Seoul, KR;

ChoongYoul Kim, Seoul, KR;

HyunGoo Kang, Seoul, KR;

KiHo Hong, Seoul, KR;

Assignee:
Attorney:
Primary Examiner:
Assistant Examiner:
Int. Cl.
CPC ...
H01L 33/00 (2010.01); H01L 25/075 (2006.01); H01L 33/48 (2010.01); H01L 33/56 (2010.01); H01L 33/60 (2010.01);
U.S. Cl.
CPC ...
H01L 25/0753 (2013.01); H01L 33/486 (2013.01); H01L 33/56 (2013.01); H01L 33/60 (2013.01); H01L 2933/0091 (2013.01); H01L 2224/48091 (2013.01);
Abstract

A light emitting device package is provided that comprises first and second light emitting devices including light emitting diodes, a body a body having a first cavity in which the first light emitting device is positioned and a second cavity in which the second light emitting device is positioned and a resin material formed in the cavity, wherein the resin material includes, a first resin material formed in the first cavity, a second resin material formed in the second cavity, and a third resin material formed an upper surface of the first and second resin materials, wherein at least one of the first resin material and the second resin material includes a light diffusing material.


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