The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
May. 26, 2015

Filed:

Jan. 31, 2011
Applicants:

Peter Scott Andrews, Durham, NC (US);

Raymond Rosado, Apex, NC (US);

Michael P. Laughner, Cary, NC (US);

David T. Emerson, Chapel Hill, NC (US);

Amber C. Abare, Durham, NC (US);

Jeffrey C. Britt, Cary, NC (US);

Inventors:

Peter Scott Andrews, Durham, NC (US);

Raymond Rosado, Apex, NC (US);

Michael P. Laughner, Cary, NC (US);

David T. Emerson, Chapel Hill, NC (US);

Amber C. Abare, Durham, NC (US);

Jeffrey C. Britt, Cary, NC (US);

Assignee:

Cree, Inc., Durham, NC (US);

Attorneys:
Primary Examiner:
Int. Cl.
CPC ...
H01L 33/62 (2010.01); H01L 25/075 (2006.01); H01L 33/58 (2010.01);
U.S. Cl.
CPC ...
H01L 25/0753 (2013.01); H01L 33/62 (2013.01); H01L 2224/48091 (2013.01); H01L 33/58 (2013.01);
Abstract

High density multi-chip LED devices are described. Embodiments of the present invention provide high-density, multi-chip LED devices with relatively high efficiency and light output in a compact size. An LED device includes a plurality of interconnected LED chips and an optical element such as a lens. The LED chips may be arranged in two groups, wherein the LED chips within each group are connected in parallel and the groups are connected in series. In some embodiments, the LED device includes a submount, which may be made of ceramic. The submount may include a connection bus and semicircular areas to which chips are bonded. Wire bonds can be connected to the LED chips so that all the wire bonds are disposed on the outside of a group of LED chips to minimize light absorption.


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