The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
May. 26, 2015

Filed:

Dec. 05, 2013
Applicant:

Nano and Advanced Materials Institute Limited, New Territories, Hong Kong, CN;

Inventors:

Kei May Lau, Hong Kong, CN;

Zhaojun Liu, Hong Kong, CN;

Assignee:

NANO AND ADVANCED MATERIALS INSTITUTE LIMITED, Shatin, New Territories, Hong Kong, CN;

Attorneys:
Primary Examiner:
Int. Cl.
CPC ...
H01L 29/201 (2006.01); G09G 3/32 (2006.01); H01L 27/15 (2006.01); H01L 27/32 (2006.01); H01L 33/50 (2010.01); H01L 33/62 (2010.01);
U.S. Cl.
CPC ...
G09G 3/32 (2013.01); H01L 27/3265 (2013.01); H01L 27/156 (2013.01); G09G 2300/0452 (2013.01); G09G 2300/0842 (2013.01); H01L 33/504 (2013.01); H01L 33/508 (2013.01); H01L 33/62 (2013.01); H01L 2924/0002 (2013.01);
Abstract

A high-resolution, Active Matrix (AM) programmed monolithic Light Emitting Diode (LED) micro-array is fabricated using flip-chip technology. The fabrication process includes fabrications of an LED micro-array and an AM panel, and combining the resulting LED micro-array and AM panel using the flip-chip technology. The LED micro-array is grown and fabricated on a sapphire substrate and the AM panel can be fabricated using PMOS process, NMOS process, or CMOS process. LED pixels in a same row share a common N-bus line that is connected to the ground of AM panel while p-electrodes of the LED pixels are electrically separated such that each p-electrode is independently connected to an output of drive circuits mounted on the AM panel. The LED micro-array is flip-chip bonded to the AM panel so that the AM panel controls the LED pixels individually and the LED pixels exhibit excellent emission uniformity. According to this constitution, incompatibility between the LED process and the PMOS/NMOS/CMOS process can be eliminated.


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