The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
May. 26, 2015

Filed:

Jul. 27, 2011
Applicants:

Siegfried Herrmann, Neukirchen, DE;

Helmut Fischer, Lappersdorf, DE;

Inventors:

Siegfried Herrmann, Neukirchen, DE;

Helmut Fischer, Lappersdorf, DE;

Assignee:
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H01L 33/62 (2010.01); H01L 21/00 (2006.01); H01L 33/00 (2010.01); H01L 33/64 (2010.01); H01S 5/02 (2006.01); H01S 5/022 (2006.01); H01L 33/38 (2010.01); H01L 33/48 (2010.01);
U.S. Cl.
CPC ...
H01L 33/62 (2013.01); H01L 33/0079 (2013.01); H01L 33/38 (2013.01); H01L 33/486 (2013.01); H01L 33/647 (2013.01); H01L 2224/48091 (2013.01); H01L 2933/0016 (2013.01); H01S 5/0217 (2013.01); H01S 5/02256 (2013.01); H01L 2924/01068 (2013.01); H01L 33/48 (2013.01); H01L 2224/48247 (2013.01);
Abstract

The invention relates to an optoelectronic semiconductor component, comprising a substrate-free optoelectronic semiconductor chip (), which has a first main surface () on an upper face and a second main surface () on a lower face, and a metal carrier (), which is arranged on the lower face of the optoelectronic semiconductor chip (), wherein the metal carrier () protrudes over the optoelectronic semiconductor chip () in at least one lateral direction () and the metal carrier () is deposited on the second main surface () of the optoelectronic semiconductor chip () using a galvanic or electroless plating method.


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