The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Patent No.:

US 9041010 B1

PDF
Full Text
Expired
Date of Patent:
May. 26, 2015

Filed:

May. 29, 2013
Applicants:

William F. Seng, Edgewood, NM (US);

Richard L. Glover, Albuquerque, NM (US);

Inventors:

William F. Seng, Edgewood, NM (US);

Richard L. Glover, Albuquerque, NM (US);

Assignee:

Other;

Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H01L 21/02 (2006.01); H01L 29/20 (2006.01); H01L 29/66 (2006.01); H01L 29/16 (2006.01); H01L 29/40 (2006.01); C30B 30/08 (2006.01); C30B 9/10 (2006.01); C30B 19/02 (2006.01); C30B 19/10 (2006.01); C30B 29/36 (2006.01); C30B 33/02 (2006.01); H01L 29/10 (2006.01); C30B 29/40 (2006.01); H01L 29/872 (2006.01);
U.S. Cl.
CPC ...
C30B 30/08 (2013.01); H01L 21/02529 (2013.01); H01L 29/1608 (2013.01); H01L 21/02378 (2013.01); C30B 9/10 (2013.01); C30B 19/02 (2013.01); C30B 19/10 (2013.01); C30B 29/36 (2013.01); C30B 29/40 (2013.01); C30B 33/02 (2013.01); H01L 21/0237 (2013.01); H01L 21/02546 (2013.01); H01L 21/02625 (2013.01); H01L 21/02628 (2013.01); H01L 29/66053 (2013.01); H01L 29/872 (2013.01); H01L 29/1075 (2013.01); H01L 29/2003 (2013.01);
Abstract

Wide band gap semiconductor wafers with previously unattainable characteristics and the method of processing and producing the same are disclosed and claimed herein. Specifically, the application discloses and claims a method to process silicon carbide and other similar wide band gap semiconductors in a microgravity environment. The wafers are placed onto stackable containment systems that create an appropriate gap between each wafer to allow for homogeneous heating and processing. The resulting wide band gap semiconductors have unique molecular structures not attainable when wide band gap semiconductors with the identical chemical composition are produced in a standard 1 gravity environment.


Find Patent Forward Citations

Seng, William. (2015). Wide band gap semiconductor wafers grown and processed in a microgravity environment and method of production (U.S. Patent No. 9041010). U.S. Patent and Trademark Office. https://idiyas.com/patent/badge/9041010

Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile

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