The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
May. 26, 2015
Filed:
Sep. 28, 2010
Kenichi Senda, Settsu, JP;
Kenichi Senda, Settsu, JP;
KANEKA CORPORATION, Osaka-Shi, JP;
Abstract
Polypropylene resin expanded particles include polypropylene resin as base material resin having at least two melting peaks on a DSC curve, the at least two melting peaks including (i) a lowest-temperature melting peak of 100° C. or more but 130° C. or less and (ii) a highest-temperature melting peak of 140° C. or more but 160° C. or less, so that the expanded particles: produce an in-mold foaming molded product at a very low mold heating steam pressure; exhibit low distortion, low shrinkage, and a wide range of heating condition for molding, even if the mold heating steam pressure is increased; have satisfactory moldability when the expanded particles are molded by using a mold having a complicated shape or a large mold; and maintain properties such as compressive strength, substantially unimpaired, when the expanded particles make the in-mold foaming molded product.