The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
May. 26, 2015
Filed:
Aug. 01, 2013
Applicant:
Toyoda Gosei Co., Ltd., Kiyosu-shi, JP;
Inventors:
Takayoshi Yajima, Kiyosu, JP;
Hiroshi Ito, Kiyosu, JP;
Assignee:
Toyoda Gosei Co., Ltd., Kiyosu-shi, Aichi-ken, JP;
Attorney:
Primary Examiner:
Assistant Examiner:
Int. Cl.
CPC ...
H01L 21/44 (2006.01); H01L 33/50 (2010.01); H01L 33/22 (2010.01); H01L 33/48 (2010.01); H01L 33/64 (2010.01);
U.S. Cl.
CPC ...
H01L 33/50 (2013.01); H01L 33/508 (2013.01); H01L 33/22 (2013.01); H01L 33/486 (2013.01); H01L 33/505 (2013.01); H01L 33/644 (2013.01); H01L 2933/0033 (2013.01); H01L 2924/0002 (2013.01);
Abstract
A method for manufacturing a semiconductor light emitting device comprises a sealing step of sealing a semiconductor chip fixed on a lead frame with a sealing member, a removal step of removing the sealing member until a surface of the semiconductor chip becomes exposed, an irregularity formation step of forming fine irregularities on a bond surface formed in the removal step, and a bonding step of bonding a wavelength conversion member to the bond surface.