The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
May. 26, 2015
Filed:
Sep. 07, 2012
Applicants:
Nagesh Vodrahalli, Los Altos, CA (US);
Jon M. Long, Livermore, CA (US);
Inventors:
Nagesh Vodrahalli, Los Altos, CA (US);
Jon M. Long, Livermore, CA (US);
Assignee:
Altera Corporation, San Jose, CA (US);
Primary Examiner:
Int. Cl.
CPC ...
H01L 21/00 (2006.01); H01L 21/44 (2006.01); H01L 25/065 (2006.01); H01L 23/00 (2006.01);
U.S. Cl.
CPC ...
H01L 25/0657 (2013.01); H01L 2224/13147 (2013.01); H01L 2224/1403 (2013.01); H01L 2224/1703 (2013.01); H01L 2225/06517 (2013.01); H01L 2225/06513 (2013.01); H01L 24/11 (2013.01); H01L 24/13 (2013.01); H01L 24/14 (2013.01); H01L 24/16 (2013.01); H01L 24/17 (2013.01); H01L 24/81 (2013.01); H01L 2224/1146 (2013.01); H01L 2224/11845 (2013.01); H01L 2224/13082 (2013.10); H01L 2224/13111 (2013.10); H01L 2224/16145 (2013.10); H01L 2224/81191 (2013.10); H01L 2224/81203 (2013.10); H01L 2224/11474 (2013.10); H01L 2224/11906 (2013.10); H01L 2224/29099 (2013.10); H01L 2224/32225 (2013.10); H01L 2224/73253 (2013.10);
Abstract
A method of fabricating an electronic assembly includes fabricating first and second interconnects. The first interconnect is adapted to interconnect a first die to a substrate. The second interconnect is adapted to interconnect the first die to a second die. The method further includes assembling the first die, the second die, and the substrate together such that the first die is disposed above the substrate, and the second die is disposed below the first die.