The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
May. 26, 2015

Filed:

Oct. 21, 2013
Applicants:

Johannes Classen, Reutlingen, DE;

Axel Franke, Wannweil, DE;

Jens Frey, Filderstadt, DE;

Heribert Weber, Nuertingen, DE;

Frank Fischer, Gomaringen, DE;

Patrick Wellner, Walddorfhaeslach, DE;

Inventors:

Johannes Classen, Reutlingen, DE;

Axel Franke, Wannweil, DE;

Jens Frey, Filderstadt, DE;

Heribert Weber, Nuertingen, DE;

Frank Fischer, Gomaringen, DE;

Patrick Wellner, Walddorfhaeslach, DE;

Assignee:

ROBERT BOSCH GMBH, Stuttgart, DE;

Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H01L 21/00 (2006.01); B81C 1/00 (2006.01); B81B 3/00 (2006.01); B81B 7/00 (2006.01);
U.S. Cl.
CPC ...
B81C 1/00015 (2013.01); B81B 3/0018 (2013.01); B81B 7/0058 (2013.01);
Abstract

A manufacturing method for a cap, for a hybrid vertically integrated component having a MEMS component a relatively large cavern volume having a low cavern internal pressure, and a reliable overload protection for the micromechanical structure of the MEMS component. A cap structure is produced in a flat cap substrate in a multistep anisotropic etching, and includes at least one mounting frame having at least one mounting surface and a stop structure, on the cap inner side, having at least one stop surface, the surface of the cap substrate being masked for the multistep anisotropic etching with at least two masking layers made of different materials, and the layouts of the masking layers and the number and duration of the etching steps being selected so that the mounting surface, the stop surface, and the cap inner side are situated at different surface levels of the cap structure.


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