The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
May. 26, 2015

Filed:

Apr. 08, 2011
Applicants:

Yueh-lin Loo, Princeton, NJ (US);

Jong Bok Kim, Plainsboro, NJ (US);

Inventors:

Yueh-Lin Loo, Princeton, NJ (US);

Jong Bok Kim, Plainsboro, NJ (US);

Assignee:
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H01L 21/00 (2006.01); H01L 51/00 (2006.01); B82Y 10/00 (2011.01); H01L 51/42 (2006.01);
U.S. Cl.
CPC ...
H01L 51/0024 (2013.01); B82Y 10/00 (2013.01); H01L 51/0023 (2013.01); H01L 51/0036 (2013.01); H01L 51/0047 (2013.01); H01L 51/4246 (2013.01); H01L 51/4253 (2013.01); Y02E 10/549 (2013.01);
Abstract

There is disclosed a modular lamination approach for processing organic photosensitive devices that allows the individual processing of device components, that once processed are brought together in a final step to make electrical contact. The disclosed method of preparing a laminated photosensitive device having at least one donor-acceptor heterojunction comprises: preparing a top electrode by depositing a functional material on a flexible substrate, such as an elastomer; optionally processing the functional material to obtain desired properties prior to lamination; preparing a bottom portion by depositing a second functional material over a substrate; optionally processing the second functional material to obtain desired properties prior to lamination; and coupling the top electrode to said bottom portion to form a laminated photosensitive device.


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