The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
May. 26, 2015
Filed:
Dec. 25, 2012
Hong Fu Jin Precision Industry (Shenzhen) Co., Ltd., Shenzhen, CN;
Hon Hai Precision Industry Co., Ltd., New Taipei, TW;
Yong Li, Shenzhen, CN;
Wen-Hsiung Chen, New Taipei, TW;
Shin-Wen Chen, New Taipei, TW;
Shu-Sheng Peng, Shenzhen, CN;
Wen-Chang Chen, New Taipei, TW;
Yu-Tsan Cheng, New Taipei, TW;
Ling-Qi Yi, Shenzhen, CN;
Li-Min Liu, Shenzhen, CN;
Fu-Li Long, Shenzhen, CN;
Fu-Chun Li, Shenzhen, CN;
HONG FU JIN PRECISION INDUSTRY (ShenZhen) CO., LTD., Shenzhen, CN;
HON HAI PRECISION INDUSTRY CO., LTD., New Taipei, TW;
Abstract
A SMT tape includes a carrier tape, a number of separation pads, a number of workpieces, and a package tape. The carrier tape includes a package surface and defines a number of receiving grooves in the package surface and arranged along a length direction of the carrier tape. The separation pads are received in the receiving grooves and fixed to bottom surfaces of the receiving grooves respectively. Each separation pad includes a separation surface opposite to a bottom surface of the corresponding receiving groove and a number of protrusions protruding up from the separation surface. The workpieces are respectively received in the receiving grooves. Each workpiece includes a main body and an adhesive layer positioned between the corresponding separation pad and the main body. The package tape is adhered to the package surface and seals the receiving grooves.