The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
May. 26, 2015

Filed:

Aug. 05, 2011
Applicants:

Andrew Hunt, Norcross, GA (US);

Yongdong Jiang, Johns Creek, GA (US);

Kenneth Scott Laverdure, Plano, TX (US);

Anthony Robert Knoerzer, Parker, TX (US);

Inventors:

Andrew Hunt, Norcross, GA (US);

Yongdong Jiang, Johns Creek, GA (US);

Kenneth Scott Laverdure, Plano, TX (US);

Anthony Robert Knoerzer, Parker, TX (US);

Assignee:
Attorneys:
Primary Examiner:
Int. Cl.
CPC ...
C23C 16/00 (2006.01); C23C 16/40 (2006.01); C23C 16/02 (2006.01); C23C 16/50 (2006.01); C23C 14/02 (2006.01); C23C 16/453 (2006.01);
U.S. Cl.
CPC ...
C23C 16/40 (2013.01); C23C 16/0272 (2013.01); C23C 16/402 (2013.01); C23C 16/50 (2013.01); C23C 14/02 (2013.01); C23C 16/02 (2013.01); C23C 16/401 (2013.01); C23C 16/453 (2013.01);
Abstract

An inorganic nanolayer surface coated polymer film product is disclosed with enhancements such as improved metallization capability, low cost, low polymer additives and modifiers, improved recyclability, and good web properties. Also method for priming a flexible film substrate to enhance the reactivity or wettability of the substrate for metallization is disclosed. A substrate film is coated with one or more nanolayers of a metal or metal oxide applied by CCVD and/or PECVD at open atmosphere. The deposited coating acts to enhance the surface energy of the film substrate and to and reduce the surface gauge variation of the substrate or supporting film, thereby enhancing the wettability of the film substrate for metallization and/or to improve the anti-block characteristics of the film. The deposited coatings may also act as a barrier layer for lowering the permeability of light, gas and vapor transmission through the substrate.


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