The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
May. 26, 2015
Filed:
Mar. 27, 2012
Applicants:
Abayomi I. Owei, Rancho Cucamonga, CA (US);
Hiep X. Nguyen, West Covina, CA (US);
Eric Yakobson, Aliso Viejo, CA (US);
Inventors:
Abayomi I. Owei, Rancho Cucamonga, CA (US);
Hiep X. Nguyen, West Covina, CA (US);
Eric Yakobson, Aliso Viejo, CA (US);
Assignee:
Enthone Inc., West Haven, CT (US);
Attorney:
Primary Examiner:
Assistant Examiner:
Int. Cl.
CPC ...
C09J 171/02 (2006.01); C23C 22/52 (2006.01); C23F 1/18 (2006.01); H05K 3/38 (2006.01);
U.S. Cl.
CPC ...
C09J 171/02 (2013.01); C23C 22/52 (2013.01); C23F 1/18 (2013.01); H05K 3/383 (2013.01); H05K 2203/0796 (2013.01); H05K 2203/122 (2013.01); H05K 2203/124 (2013.01); Y10S 428/901 (2013.01);
Abstract
An adhesion promotion process and composition for enhancing adhesion between a copper conducting layer and a dielectric material during manufacture of a printed circuit board. The composition contains a corrosion inhibitor, an inorganic acid, and an alcohol which is effective to increase copper-loading in the composition.