The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
May. 26, 2015
Filed:
Jun. 28, 2012
Applicants:
Kazuaki Ebata, Sodegaura, JP;
Shigekazu Tomai, Sodegaura, JP;
Kota Terai, Sodegaura, JP;
Shigeo Matsuzaki, Sodegaura, JP;
Koki Yano, Sodegaura, JP;
Inventors:
Kazuaki Ebata, Sodegaura, JP;
Shigekazu Tomai, Sodegaura, JP;
Kota Terai, Sodegaura, JP;
Shigeo Matsuzaki, Sodegaura, JP;
Koki Yano, Sodegaura, JP;
Assignee:
IDEMITSU KOSAN CO., LTD., Tokyo, JP;
Attorney:
Primary Examiner:
Assistant Examiner:
Int. Cl.
CPC ...
H01L 21/283 (2006.01); H01L 29/788 (2006.01); C23C 14/08 (2006.01); C23C 14/34 (2006.01); H01L 21/02 (2006.01); C01G 15/00 (2006.01); H01B 1/08 (2006.01); H01L 29/786 (2006.01); C04B 35/01 (2006.01); C04B 35/626 (2006.01); H01L 27/12 (2006.01);
U.S. Cl.
CPC ...
H01L 21/02565 (2013.01); C01G 15/00 (2013.01); H01B 1/08 (2013.01); C23C 14/08 (2013.01); C23C 14/3414 (2013.01); H01L 29/7869 (2013.01); C04B 35/01 (2013.01); C04B 35/6261 (2013.01); C04B 2235/3206 (2013.01); C04B 2235/3232 (2013.01); C04B 2235/3244 (2013.01); C04B 2235/3286 (2013.01); C04B 2235/3287 (2013.01); C04B 2235/3293 (2013.01); C04B 2235/3418 (2013.01); C04B 2235/5436 (2013.01); C04B 2235/5445 (2013.01); C04B 2235/604 (2013.01); C04B 2235/6562 (2013.01); C04B 2235/6565 (2013.01); C04B 2235/6567 (2013.01); C04B 2235/6584 (2013.01); C04B 2235/6585 (2013.01); C04B 2235/664 (2013.01); C04B 2235/77 (2013.01); C04B 2235/80 (2013.01); C04B 2235/963 (2013.01); C23C 14/081 (2013.01); C23C 14/086 (2013.01); H01L 21/02631 (2013.01); H01L 27/1225 (2013.01);
Abstract
A sputtering target including a sintered body including In, Ga and Mg,