The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
May. 26, 2015
Filed:
Sep. 23, 2011
Applicants:
Koji Sugiyama, Kyoto, JP;
Rina Matsumi, Kyoto, JP;
Satoshi Yonehara, Kyoto, JP;
Inventors:
Assignee:
ARKRAY, Inc., Kyoto, JP;
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
G01N 27/447 (2006.01); B01L 3/00 (2006.01); B32B 3/02 (2006.01); B32B 3/26 (2006.01); B32B 3/30 (2006.01); B32B 7/10 (2006.01); B32B 7/12 (2006.01); B32B 27/08 (2006.01); B32B 27/16 (2006.01); B32B 38/00 (2006.01); C09J 5/02 (2006.01); B29C 65/00 (2006.01); B29L 31/00 (2006.01); B32B 27/30 (2006.01); B32B 37/00 (2006.01); B32B 37/20 (2006.01);
U.S. Cl.
CPC ...
G01N 27/44791 (2013.01); B01L 3/502707 (2013.01); B01L 2300/0816 (2013.01); B01L 2400/0421 (2013.01); B29C 66/026 (2013.01); B29C 66/028 (2013.01); B29C 66/53461 (2013.01); B29C 66/54 (2013.01); B29L 2031/756 (2013.01); B32B 3/02 (2013.01); B32B 3/266 (2013.01); B32B 3/30 (2013.01); B32B 7/10 (2013.01); B32B 7/12 (2013.01); B32B 27/08 (2013.01); B32B 27/16 (2013.01); B32B 27/308 (2013.01); B32B 37/0076 (2013.01); B32B 37/203 (2013.01); B32B 38/00 (2013.01); B32B 38/0004 (2013.01); B32B 2037/0092 (2013.01); B32B 2038/0076 (2013.01); B32B 2250/02 (2013.01); B32B 2250/24 (2013.01); B32B 2333/12 (2013.01); C09J 5/02 (2013.01);
Abstract
The present invention provides a device that decreases deformation during manufacturing of the device, provides a firm joint without use of an adhesive, and allows chemical modification of a channel during manufacturing of the device. The device includes two joined substrates, and a concavity is formed on at least one of the opposing surfaces of the two substrates so as to make a channel, where the two substrates are joined together by a covalent bond via a crosslinking agent (A), and the crosslinking agent (A) is exposed on an inner wall surface of the channel.