The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
May. 26, 2015
Filed:
Dec. 07, 2011
Yasuo Takeda, Tsu, JP;
Nobuyuki Imanishi, Tsu, JP;
Takahito Itoh, Tsu, JP;
Takahiro Uno, Tsu, JP;
Akira Itsubo, Tsu, JP;
Eiichi Nomura, Tsu, JP;
Shigemitsu Katoh, Tsu, JP;
Kiyotsugu Okuda, Tsu, JP;
Yasuo Takeda, Tsu, JP;
Nobuyuki Imanishi, Tsu, JP;
Takahito Itoh, Tsu, JP;
Takahiro Uno, Tsu, JP;
Akira Itsubo, Tsu, JP;
Eiichi Nomura, Tsu, JP;
Shigemitsu Katoh, Tsu, JP;
Kiyotsugu Okuda, Tsu, JP;
Mie Industry and Enterprise Support Center, Tsu-shi, JP;
Abstract
The whole of a conductive material layer is formed on a bonding surface of an outer film having flexibility and barrier properties to prepare a composite body in which the conductive material layer is integrated with the outer film. A current collector is located within an application region, and at least a part of an electrode terminal is located outside the application region. A positive electrode active material precursor layer, an electrolyte precursor layer, and a negative electrode active material precursor layer are added to the composite body with plane positions thereof aligned with that of the current collector. These precursor layers are subjected to a crosslinking process. The application regions are applied, and the outer films are bonded, to seal a cell. The crosslinking process may be omitted.