The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
May. 26, 2015

Filed:

May. 30, 2014
Applicant:

Lg Electronics Inc., Seoul, KR;

Inventors:

Hokyun Ju, Seoul, KR;

Inhwan Ra, Seoul, KR;

Kiwoong Park, Seoul, KR;

Assignee:

LG ELECTRONICS INC., Seoul, KR;

Attorney:
Primary Examiner:
Int. Cl.
CPC ...
F21V 29/00 (2006.01); F21K 99/00 (2010.01); F21V 3/02 (2006.01); F21V 17/00 (2006.01); F21V 23/00 (2006.01); F21V 7/00 (2006.01); F21V 23/04 (2006.01);
U.S. Cl.
CPC ...
F21V 29/2206 (2013.01); F21V 29/2231 (2013.01); F21K 9/1355 (2013.01); F21K 9/1375 (2013.01); F21V 3/02 (2013.01); F21V 17/002 (2013.01); F21V 23/009 (2013.01); F21K 9/52 (2013.01); F21V 29/22 (2013.01); F21V 7/00 (2013.01); F21V 23/045 (2013.01);
Abstract

Disclosed is a lighting apparatus which may include a heat sink, a light emitting device including a substrate mounted on the heat sink and LEDs arranged on the substrate, a bulb surrounding the light emitting device, an electronic module received within the heat sink to supply power to the light emitting device, a case provided to surround the electronic module, the case being configured to be inserted into the heat sink, a communication module separably coupled to the electronic module, and a power socket electrically connected to the electronic module, the power socket being mounted to the case. The communication module may include a housing, a circuit board provided in the housing. The circuit board may be electrically connected to the electronic module, and a wireless communication device may be provided on the circuit board.


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