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The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Patent No.:

US 9037063 B1

PDFFull Text
Date of Patent:
May. 19, 2015

Filed:

Jun. 28, 2013

Method of forming thin resistive heating layer, heating member including the thin resistive heating layer, and fusing unit including the heating member

Applicant:

Samsung Electronics Co., Ltd., Suwon-Si, Gyeonggi-Do, KR;

Inventors:

Sang-eui Lee, Hwaseong-si, KR;

Ha-jin Kim, Hwaseong-si, KR;

Dong-earn Kim, Seoul, KR;

Dong-ouk Kim, Pyeongtaek-si, KR;

Sung-hoon Park, Seoul, KR;

Min-jong Bae, Yongin-si, KR;

Yoon-chul Son, Hwaseong-si, KR;

Kun-mo Chu, Seoul, KR;

Assignee:

Samsung Electronics Co., Ltd., Gyeonggi-do, KR;

Attorney:

Harness, Dickey & Pierce, P.L.C.

Primary Examiner:

G M Hyder

Int. Cl.
CPC ...
G03G 15/20 (2006.01); H01C 17/02 (2006.01); H01C 17/06 (2006.01); H05B 3/46 (2006.01); H05B 3/14 (2006.01); H05B 3/00 (2006.01); B82Y 30/00 (2011.01); H01C 17/065 (2006.01);
U.S. Cl.
CPC ...
G03G 15/2057 (2013.01); H01C 17/02 (2013.01); H01C 17/06 (2013.01); H05B 3/46 (2013.01); H05B 3/145 (2013.01); B82Y 30/00 (2013.01); H01C 17/0652 (2013.01); H01C 17/06586 (2013.01); H05B 3/0095 (2013.01); H05B 2203/013 (2013.01); H05B 2214/04 (2013.01);
Abstract

A method of forming a thin film resistive heating layer, the method including: forming a polymer layer by extruding a polymer paste, in which an electrically conductive filler is dispersed, by using an extrusion molding operation, on an outer circumferential surface of a cylindrical member; and forming a thin film resistive heating layer by making an outer diameter of the polymer layer uniform by using a ring blading operation.

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