The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
May. 19, 2015

Filed:

Mar. 04, 2013
Applicant:

Rwth Aachen University, Aachen, DE;

Inventors:

Jeremy Witzens, Cologne, DE;

Florian Merget, Wuerselen, DE;

Assignee:
Attorney:
Primary Examiner:
Assistant Examiner:
Int. Cl.
CPC ...
G02F 1/01 (2006.01); G02B 6/00 (2006.01); G02F 1/225 (2006.01); G02F 1/025 (2006.01); G02F 1/015 (2006.01);
U.S. Cl.
CPC ...
G02F 1/2255 (2013.01); G02F 1/025 (2013.01); G02F 1/0121 (2013.01); G02F 1/2257 (2013.01); G02F 2001/0152 (2013.01);
Abstract

An electro-optical modulator with two electrodes as part of a transmission line of a first phase modulator and two electrodes as part of a transmission line of a second phase modulator included in two arms of a Mach-Zehnder-interferometer. An electrical controller applies a first electrical high-frequency-modulated voltage signals between the first and second electrodes and applies a second electrical high-frequency-modulated signals between the fourth and third electrodes. The electrical controller applies signals such that voltages applied to the first and fourth electrodes have substantially a same high-frequency content, and voltages applied to the second and third electrodes have substantially the same high-frequency content. In such configuration, a constant voltage offset is produced by either the voltages applied to the first and fourth electrodes or, the second and third electrodes. Thereby, cross-talk between electrodes, electrical losses, device size and fabrication costs may be reduced.


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