The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
May. 19, 2015
Filed:
Jul. 27, 2010
Reddy Raju, Fremont, CA (US);
Richard L. Duesterberg, Mountain View, CA (US);
Jay A. Skidmore, San Jose, CA (US);
Prasad Yalamanchili, Santa Clara, CA (US);
Xiangdong Qiu, Cupertino, CA (US);
Reddy Raju, Fremont, CA (US);
Richard L. Duesterberg, Mountain View, CA (US);
Jay A. Skidmore, San Jose, CA (US);
Prasad Yalamanchili, Santa Clara, CA (US);
Xiangdong Qiu, Cupertino, CA (US);
JDS Uniphase Corporation, Milpitas, CA (US);
Abstract
A fiber coupled semiconductor device and a method of manufacturing of such a device are disclosed. The method provides an improved stability of optical coupling during assembly of the device, whereby a higher optical power levels and higher overall efficiency of the fiber coupled device can be achieved. The improvement is achieved by attaching the optical fiber to a vertical mounting surface of a fiber mount. The platform holding the semiconductor chip and the optical fiber can be mounted onto a spacer mounted on a base. The spacer has an area smaller than the area of the platform, for mechanical decoupling of thermally induced deformation of the base from a deformation of the platform of the semiconductor device. Optionally, attaching the fiber mount to a submount of the semiconductor chip further improves thermal stability of the packaged device.