The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
May. 19, 2015

Filed:

Dec. 24, 2010
Applicants:

Haruo Suenaga, Osaka, JP;

Nobuo Shirokawa, Shiga, JP;

Hideaki Moriya, Shiga, JP;

Manabu Kinoshita, Shiga, JP;

Inventors:

Haruo Suenaga, Osaka, JP;

Nobuo Shirokawa, Shiga, JP;

Hideaki Moriya, Shiga, JP;

Manabu Kinoshita, Shiga, JP;

Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H02H 7/122 (2006.01); H02M 3/335 (2006.01); H02M 3/28 (2006.01); H05B 6/66 (2006.01);
U.S. Cl.
CPC ...
H02M 3/28 (2013.01); H05B 6/666 (2013.01);
Abstract

Provided is a configuration in which it is possible to mount an applied voltage suppression circuit configured to prevent voltage breakdown of a semiconductor switching element, and a set voltage thereof can be inspected without damaging an IC or the like of a peripheral circuit. In a power converter having a semiconductor switching element, an applied voltage suppression circuit configured to suppress a voltage applied to the semiconductor switching element and at least one component of constituent components of a driving circuit which causes the semiconductor switching element to be turned off if the component is absent are transferred to and disposed on a slave substrate (separate unit) which is divided from and electrically connected to a master substrate including the semiconductor switching element, the driving circuit, a control circuit, and the like mounted thereon.


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