The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
May. 19, 2015

Filed:

Oct. 15, 2012
Applicant:

Sumitomo Wiring Systems, Ltd., Yokkaichi, JP;

Inventors:

Akira Baba, Yokkaichi, JP;

Tatsuya Oka, Yokkaichi, JP;

Assignee:
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H05K 1/00 (2006.01); H05K 1/18 (2006.01); H05K 7/00 (2006.01); H05K 1/14 (2006.01); H01R 12/52 (2011.01);
U.S. Cl.
CPC ...
H05K 1/144 (2013.01); H05K 1/181 (2013.01); H01R 12/52 (2013.01); H05K 2201/042 (2013.01); H05K 2201/10303 (2013.01); H05K 2201/10424 (2013.01); H05K 2201/2036 (2013.01);
Abstract

A printed circuit board laminate is provided of a novel structure that is not only capable of enhancing a degree of freedom in design and achieving a further size reduction, but also capable of enhancing heat releasing performance in a space sandwiched in between two printed circuit boards. A lattice-like portion formed of a plurality of connection walls crossed with one another is provided to an insulating plate interposed between two printed circuit boards, and the connection walls are positioned with clearances from the two printed circuit boards, respectively, by a plurality of supporting ribs protruding from the connection walls toward at least one of the two printed circuit boards.


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