The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
May. 19, 2015

Filed:

Jan. 15, 2013
Applicant:

Flextronics Ap, Llc, Broomfield, CO (US);

Inventors:

Dason Cheung, Fremont, CA (US);

Murad Kurwa, San Jose, CA (US);

Richard Loi, San Jose, CA (US);

Assignee:

Flextronics, AP, LLC, Broomfield, CO (US);

Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H05K 3/00 (2006.01); B23P 15/26 (2006.01); F28F 7/00 (2006.01); G05B 19/02 (2006.01); H01L 21/48 (2006.01); H05K 13/00 (2006.01); H05K 13/04 (2006.01); H05K 1/02 (2006.01);
U.S. Cl.
CPC ...
F28F 7/00 (2013.01); G05B 19/02 (2013.01); Y10T 29/4935 (2015.01); H01L 21/4882 (2013.01); H05K 1/0209 (2013.01); H05K 13/00 (2013.01); H05K 2201/066 (2013.01); H05K 2201/09781 (2013.01);
Abstract

Methods of and apparatuses for electronic board assembly are provided. The apparatus can comprises one or more thermal heads controlled by a programmable logic controller. A user is able to enter the controlling parameters into the programmable logic controller through an human operator interface. The thermal heads are able to be connected with one or more pneumatic solenoid to make the thermal heads moving vertically until the thermal head in contact with the heat sink. The thermal head is able to provide a temperature, at or above the operating temperature of the thermal pad, capable of making the phase change thermal interface material to bond the heat sink and the electronic boards.


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