The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
May. 19, 2015

Filed:

Jul. 29, 2009
Applicants:

Edwin Frank Rejda, Bloomington, MN (US);

Huaqing Yin, Eden Prairie, MN (US);

Marc Perry Ronshaugen, Eden Prairie, MN (US);

Inventors:

Edwin Frank Rejda, Bloomington, MN (US);

Huaqing Yin, Eden Prairie, MN (US);

Marc Perry Ronshaugen, Eden Prairie, MN (US);

Assignee:

Seagate Technology LLC, Cupertino, CA (US);

Attorney:
Primary Examiner:
Assistant Examiner:
Int. Cl.
CPC ...
G11B 5/127 (2006.01); G11B 5/31 (2006.01); G11B 5/187 (2006.01); G11B 5/60 (2006.01);
U.S. Cl.
CPC ...
G11B 5/3169 (2013.01); G11B 5/1278 (2013.01); G11B 5/1871 (2013.01); G11B 5/3116 (2013.01); G11B 5/3133 (2013.01); G11B 5/3163 (2013.01); G11B 5/6005 (2013.01);
Abstract

Recording heads for data storage systems are provided. Recording heads illustratively include a write pole, a bumper, a dielectric layer, and a surface. In some embodiments, a portion of the surface includes portions of the write pole, bumper, and dielectric layer. The write pole, bumper, and dielectric layer are illustratively made from materials that have polishing rates. In some embodiments, the polishing rate for the write pole material is more similar to the polishing rate for the bumper material than it is to the polishing rate for the dielectric layer material.


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