The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
May. 19, 2015

Filed:

Mar. 15, 2013
Applicant:

Samsung Electro-mechanics Co., Ltd., Suwon-si, Gyeonggi-do, KR;

Inventors:

Sa Yong Lee, Suwon-si, KR;

Jin Young Kim, Suwon-si, KR;

Keun Yong Lee, Suwon-si, KR;

Geum Hee Yun, Suwon-si, KR;

Moon Soo Park, Suwon-si, KR;

Assignee:

Samsung Electro-Mechanics Co., Ltd., Suwon, Gyeonggi-Do, KR;

Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H01F 5/00 (2006.01); H01F 27/28 (2006.01); H01F 17/00 (2006.01); H01F 41/04 (2006.01); H01F 17/04 (2006.01);
U.S. Cl.
CPC ...
H01F 17/0013 (2013.01); H01F 41/041 (2013.01); H01F 41/046 (2013.01); H01F 2017/048 (2013.01);
Abstract

Disclosed herein is a multilayer inductor, manufactured by stacking laminates each including: a substrate having internal electrode coil patterns formed thereon; and a magnetic substance filling the substrate on which the internal electrode coil patterns are formed, wherein the substrate is formed by using a composition including a magnetic material, so that, when the substrate is placed in the middle of the electrode circuit patterns at the time of manufacturing a power inductor, the substrate can be utilized as a gap material, and thus the thickness of an inductor chip can be minimized, and, in addition, the magnetic material is included in the substrate forming composition, thereby improving magnetic characteristics, and the liquid crystal oligomer and the nanoclay are added to the composition, to thereby increase insulating property between magnetic metals, thereby raising inductance, and thus dimensional stability and physical hardness of the structure can be secured.


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