The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
May. 19, 2015
Filed:
Nov. 27, 2013
Applicant:
Sanyo Electric Co., Ltd., Moriguchi-shi Osaka, JP;
Inventors:
Masayuki Nagamatsu, Gifu, JP;
Mayumi Nakasato, Gifu, JP;
Masurao Yoshii, Tochigi, JP;
Yasuhiro Kohara, Osaka, JP;
Kotaro Deguchi, Osaka, JP;
Assignee:
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H01L 23/48 (2006.01); H01L 23/52 (2006.01); H01L 29/40 (2006.01); H05K 1/05 (2006.01); H01L 23/373 (2006.01); H01L 21/56 (2006.01); H01L 23/31 (2006.01); H05K 3/00 (2006.01); H01L 23/498 (2006.01);
U.S. Cl.
CPC ...
H01L 23/48 (2013.01); H05K 1/053 (2013.01); H05K 1/056 (2013.01); H05K 3/0052 (2013.01); H05K 2201/0191 (2013.01); H05K 2201/0195 (2013.01); H05K 2201/09145 (2013.01); H05K 2203/049 (2013.01); H01L 23/3735 (2013.01); H01L 23/49811 (2013.01); H01L 21/561 (2013.01); H01L 2224/32225 (2013.01); H01L 2224/48091 (2013.01); H01L 2224/48227 (2013.01); H01L 2224/73265 (2013.01); H01L 23/3121 (2013.01); H01L 21/565 (2013.01); H01L 2224/45124 (2013.01); H01L 2924/13091 (2013.01); H01L 2924/13055 (2013.01);
Abstract
Prepared in advance is a substrate formed of metallic material where slits are formed between mounting regions. Oxide films are generated all over the substrate including end faces of the substrate. Exposed are only lateral faces corresponding to the cross sections cut when tie bars are cut. This structure and the fabrication method minimize the area of cutting faces in the metallic material.