The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
May. 19, 2015
Filed:
Apr. 02, 2010
Applicants:
Syunsuke Satoh, Kakogawa, JP;
Naoki Kohda, Kakogawa, JP;
Hiroki Yoshioka, Kakogawa, JP;
Inventors:
Assignee:
DAISHINKU CORPORATION, Kakogawa-shi, JP;
Attorneys:
Primary Examiner:
Int. Cl.
CPC ...
H01L 21/48 (2006.01); H01L 23/498 (2006.01); H01L 41/22 (2013.01); H03H 9/10 (2006.01); H01L 41/311 (2013.01); H03H 3/02 (2006.01); H03H 9/05 (2006.01);
U.S. Cl.
CPC ...
H03H 9/1035 (2013.01); Y10T 29/42 (2015.01); Y10T 29/49002 (2015.01); H01L 21/4846 (2013.01); H01L 23/49805 (2013.01); H01L 41/311 (2013.01); H03H 3/02 (2013.01); H03H 9/0595 (2013.01); H03H 9/1014 (2013.01);
Abstract
[Solving means] In a package member assembly, a plurality of package members are integrally formed. The package member assembly includes a plurality of bottomed holes provided on a front main face and a back main face of a wafer made of glass, and external terminals connected to side-face conductors attached to inner wall faces of the bottomed holes on the back main face.