The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
May. 19, 2015

Filed:

Apr. 21, 2014
Applicant:

Abb Technology Ag, Zürich, CH;

Inventors:

Franc Dugal, Zollikon, CH;

Dominik Trüssel, Bremgarten, CH;

Assignee:

ABB TECHNOLOGY AG, Zurich, CH;

Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H01L 23/48 (2006.01); H01L 23/492 (2006.01); H01L 23/051 (2006.01); H01L 23/62 (2006.01); H01L 23/00 (2006.01); H01L 25/07 (2006.01); H01L 23/58 (2006.01);
U.S. Cl.
CPC ...
H01L 23/492 (2013.01); H01L 23/051 (2013.01); H01L 23/62 (2013.01); H01L 24/72 (2013.01); H01L 25/072 (2013.01); H01L 2924/13055 (2013.01); H01L 23/585 (2013.01);
Abstract

A power semiconductor module and a power semiconductor module assembly, which includes a plurality of power semiconductor modules, are disclosed. The power semiconductor module includes an electrically conducting base plate, an electrically conducting top plate, arranged in parallel to the base plate and spaced apart from the base plate, at least one power semiconductor device, which is arranged on the base plate in a space formed between the base plate and the top plate, and at least one presspin, which is arranged in the space formed between the base plate and the top plate to provide contact between the semiconductor device and the top plate. A metallic protection plate can be provided at an inner face of the top plate facing towards the base plate, wherein the material of the protection plate has a melting temperature higher than the melting temperature of the top plate.


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